🔧 Ma Ant SL-1 Degumming Heating Repair Tool for Mobile Phone IC, CPU, BGA, and NAND Chip
The Ma Ant SL-1 Degumming Heating Repair Tool is an essential device for mobile phone repair technicians. Designed specifically for delicate components like ICs, CPUs, BGA, and NAND chips, it effectively removes adhesive residues, including glue and thermal paste, ensuring your repairs are clean and precise. The tool combines heating and degumming in one efficient unit, helping technicians perform maintenance with ease and accuracy.

📌 Key Features:

🔹 Degumming & Heating Function – Designed for safe and effective adhesive removal from IC, CPU, BGA, and NAND chips
🔹 Adjustable Temperature Control – Allows you to set the optimal temperature for safe degumming without damaging components
🔹 Efficient & Precise – Ideal for mobile phone motherboard repairs and rework
🔹 User-Friendly Design – Easy to operate and compact, ensuring convenience during repairs
🔹 High-Quality Build – Durable and long-lasting, perfect for professionals in the mobile repair industry

💡 Ideal For: ✔️ Mobile phone technicians handling delicate chip repairs
✔️ Removing adhesives or thermal paste from IC, CPU, BGA, and NAND chips
✔️ Professionals requiring a reliable heating and degumming solution
✔️ Anyone needing an efficient, all-in-one maintenance tool

⚠️ Installation Note:
Professional installation is recommended. This tool requires technical skill for optimal results.

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